End-pumped laser marking machine series introduces the working principle: EP semiconductor marking machine directly from the end face of the semiconductor laser crystal light into the pump, the output generated by the laser optics, so that the light conversion efficiency is greatly improved over the side of the end face of the laser laser has better laser-quality laser mode quality, product features and faster processing speed; imported semiconductor lasers, with a small spot, high precision marking, marking reliable, fast, standard effect easier debugging, and power Low, low processing costs, to meet the 24 hours of continuous full-load operation Advantages: HY-EP12 / HY-EP20 Semiconductor end laser marking system is used in Germany to integrate the latest end face of the laser, the system used in Germany and imported software galvanometer perfect match, using Optimized air-side cooling mode, the device is stable and reliable, excellent laser mode, the peak power of good, is the current high level of the semiconductor laser device Application: metals, alloys and oxides, ABS, epoxy resin, ink, etc., are widely used in electronic components, electrical appliances, jewelry, communication products, plastic buttons, translucent keys instrumentation, integrated circuits (IC) industry, more suitable for accuracy, speed and special electronic materials require higher occasions. Marking machine technical parameters Model HY-EP10 HY-EP12 HY-EP20 maximum efficacy 10W 12W 20W laser Q-switched laser maximum efficacy 10W 12W 20W Laser wavelength 1064nm beam quality M2: <1.5 M2: <1.5 M2: <2 minimum of Q 7ns 12ns 12ns laser pulse Q-switched frequency ≤10KHz marking range 100mm * 100mm optional wire-speed 50mm * 50mm 150mm * 150mm 50mm * 20mm minimum line width <8000mm / s smallest character 0.01mm repeatability of ± 0.001mm Whole consumption Power ≤1KW electricity demand 220v ± 10% Hz / 6A 220v ± 10% Hz / 8A 220v ± 10% Hz / 10A